Integrated surface inspection, internal crack detection and sorting.
jxinspect combines automated optical inspection (AOI), infrared (IR) transmission inspection and high-speed sorting in one platform. A single loading cycle supports inspection and sorting, reducing transfers and the risk of contamination or die damage. Inspection results determine the sorting destination.
Illustration: die that pass surface AOI may still contain internal cracks introduced by dicing or thinning.
Three operations, one platform
Smaller, thinner die place greater demands on surface and internal defect inspection. Complementary AOI and IR imaging methods work with high-speed sorting to translate inspection results into handling decisions.
Six-sided surface inspection
Detects surface defects including scratches, contamination, particles, edge chipping and corner damage. A proprietary prism assembly and two high-resolution industrial cameras capture the top, bottom and four sides of each die in a compact imaging system.
Infrared subsurface inspection
Uses infrared transmission imaging to inspect suitable silicon die for internal cracks and dicing-induced microcracks, complementing surface inspection. Suitability is evaluated using customer samples and depends on material, thickness and defect type.
High-speed sorting
An 8–16-station turret performs die pick-and-place and binning, with XY placement accuracy of ±15–20 μm and angular accuracy of ±1°. Throughput is expressed in units per hour (UPH) and varies with die specifications and inspection configuration.
Specifications vary with die format and inspection configuration; the agreed technical specification applies.
Benefits of integration
Fewer handling steps
Inspection and sorting take place within one machine, reducing transfers between separate systems and the associated risk of contamination or die damage.
Inspection-driven sorting
AOI and IR results are linked within one platform. Sorting decisions use both inspection results, reducing the need for data transfer and repeated alignment between machines.
Footprint and cost
Combining multiple operations on one platform helps reduce equipment footprint and simplify line configuration, operation and maintenance.
Product line
Wafer to Waffle Tray
Dicing tape to waffle tray · display driver ICsWafer to JEDEC Tray
Dicing tape to JEDEC tray · memory dieWafer to Reel
Dicing tape to carrier tape · power dieWafer to Wafer
Dicing tape to dicing tape · CMOS image sensor dieCustom configurations
Tailored to your die and process requirementsSend us your die and we will propose the best configuration
We run a cleanroom laboratory platform. Send die dimensions, thickness, carrier format and the defect types you care about, and we will return inspection results together with a recommended configuration.