Integrated inspection and sorting equipment
A shared platform supports different input and output formats, with custom configurations available. Integrates loading, precision handling, AOI and IR inspection, and multi-bin sorting.
Material flow
- LoadWafer / tray
- Turret handling8–16 stations
- AOISix-sided surface inspection
- IRInternal crack inspection
- Sorting and unloadingMulti-bin output
Product line
Wafer to Waffle Tray
Dicing tape to waffle tray · display driver ICsIntegrated inspection and sorting for elongated die up to 35 mm long, 0.6–5 mm wide and 70–1,000 μm thick. Combines six-sided AOI, IR crack inspection and high-speed sorting.
Wafer to JEDEC Tray
Dicing tape to JEDEC tray · memory dieThe same core platform, with sorting and packaging logic tuned for memory die and JEDEC standard tray output.
Wafer to Reel
Dicing tape to carrier tape · power dieInspection path optimised for silicon carbide and other power devices and for long irregular die, with tape-and-reel packaging integrated.
Wafer to Wafer
Dicing tape to dicing tape · CMOS image sensor dieInspects and sorts individual die from a diced wafer, then places them onto a destination dicing film. Supports sorting into multiple bins.
Custom configurations
Tailored to your die and process requirementsCustom handling modules, optical configurations and inspection algorithms for non-standard die dimensions, special input formats and specific defect types.
All configurations use a shared technology platform, with prism-based six-sided imaging, turret handling, IR inspection and in-house AI inspection algorithms configured for the process. Supports 8-inch and 12-inch wafers. Available functions, specifications and application scope are subject to the agreed technical specification.
Delivery and support
Installation and commissioning
On-site installation and commissioning in the cleanroom, with sample-based configuration refinement and process recipes for the relevant die formats.
Warranty
Parts damaged by faults covered under warranty are replaced at no charge during the warranty period, subject to the contract terms.
Technical support
Remote technical support and on-site service are available. Geographic coverage and conditions for on-site response within 24 hours are defined in the service agreement.
Software updates
Ongoing improvements to inspection algorithms and software features. The scope and duration of free updates are defined in the contract.
Send us your die and we will propose the best configuration
We run a cleanroom laboratory platform. Send die dimensions, thickness, carrier format and the defect types you care about, and we will return inspection results together with a recommended configuration.